3-D construction of monolithic passive components for RF...

IEEE Transactions on Microwave Theory and Techniques 2003 / 01 Vol. 51; Iss. 1

3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Jun-Bo Yoon,, Byeong-Il Kim,, Yun-Seok Choi,, Yoon, E.
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Volume:
51
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/TMTT.2002.806511
Date:
January, 2003
File:
PDF, 2.21 MB
english, 2003
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