[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Thermosonic gold ball bonding to alternate plating finishes on laminate MCM substrates
Dunn, C., Johnson, R.W., Bozack, M., Kromis, C., Harris, J., Knadler, M.Year:
1997
Language:
english
DOI:
10.1109/ICMCM.1997.581168
File:
PDF, 717 KB
english, 1997