A survey of cross-layer power-reliability tradeoffs in...

Microprocessors and Microsystems 2013 / 11 Vol. 37; Iss. 8

A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

Eltawil, Ahmed A., Engel, Michael, Geuskens, Bibiche, Djahromi, Amin Khajeh, Kurdahi, Fadi J., Marwedel, Peter, Niar, Smail, Saghir, Mazen A.R.
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Volume:
37
Language:
english
Journal:
Microprocessors and Microsystems
DOI:
10.1016/j.micpro.2013.07.008
Date:
November, 2013
File:
PDF, 1.88 MB
english, 2013
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