[IEEE 2012 IEEE 25th International SOC Conference (SOCC) - Niagara Falls, NY, USA (2012.09.12-2012.09.14)] 2012 IEEE International SOC Conference - On-chip self-calibrated process-temperature sensor for TSV 3D integration
Chiang, Tzu-Ting, Huang, Po-Tsang, Chuang, Ching-Te, Chen, Kuan-Neng, Chiou, Jin-Chern, Chen, Kuo-Hua, Chiu, Chi-Tsung, Tong, Ho-Ming, Hwang, WeiYear:
2012
Language:
english
DOI:
10.1109/SOCC.2012.6398338
File:
PDF, 1.84 MB
english, 2012