[IEEE 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS) - Cancun, Mexico (2011.01.23-2011.01.27)] 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems - Current crowding study of a micro spring contact for flip chip packaging
Cheng, Bowen, Chow, Eugene M., De Bruyker, Dirk, Shubin, Ivan, Cunningham, John, Chow, Alex, Shi, Jing, Bohringer, Karl F.Year:
2011
Language:
english
DOI:
10.1109/MEMSYS.2011.5734436
File:
PDF, 3.94 MB
english, 2011