[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Dielectric loss control of high-K polymer composites by coulomb blockade effects of metal nanoparticles for embedded capacitor applications

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