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[IEEE 1996 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA, USA (17-21 June 1996)] 1996 IEEE MTT-S International Microwave Symposium Digest - Millimeter-wave performance of chip interconnections using wire bonding and flip chip
Krems, T., Haydl, W., Massler, H., Rudiger, J.Volume:
1
Year:
1996
Language:
english
DOI:
10.1109/MWSYM.1996.508504
File:
PDF, 411 KB
english, 1996