![](/img/cover-not-exists.png)
[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - High frequency thermosonic flip chip bonding for gold to gold interconnection
Pang, C.C.-H., Kin-Yik Hung,, Man-Lung Sham,Year:
2004
Language:
english
DOI:
10.1109/ECTC.2004.1320306
File:
PDF, 351 KB
english, 2004