Development of electroplated Ni–xZn films for under bump...

Surface and Coatings Technology 2013 / 12 Vol. 237

Development of electroplated Ni–xZn films for under bump metallization application

Lin, Hsiu-Min, Duh, Jenq-Gong
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Volume:
237
Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2013.08.056
Date:
December, 2013
File:
PDF, 1.57 MB
english, 2013
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