[IEEE Symposium on Design, Test, Integration and Packaging...

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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining

Margesin, B., Bagolini, A., Guarnieri, V., Giacomozzi, F., Faes, A., Pal, R., Decarli, M.
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Year:
2003
Language:
english
DOI:
10.1109/DTIP.2003.1287077
File:
PDF, 262 KB
english, 2003
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