Stress in electroplated gold on silicon substrates and its...

Microelectronic Engineering 2013 / 12 Vol. 112

Stress in electroplated gold on silicon substrates and its dependence on cathode agitation

Pu, Suan Hui, Holmes, Andrew S., Yeatman, Eric M.
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Volume:
112
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.05.019
Date:
December, 2013
File:
PDF, 1.24 MB
english, 2013
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