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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Enhancements of bondability and die-shear force of chips thermosonically bonded to flex substrates by depositing a nickel layer
Chuang, Cheng-Li, Aoh, Jong-Ning, Pan, Chi-ChuanYear:
2011
Language:
english
DOI:
10.1109/ICEPT.2011.6066811
File:
PDF, 3.76 MB
english, 2011