[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Embedded capacitors technology in 2.4 GHz power amplifier with multi-layer printed wiring board (PWB) process
Chang-Sheng Chen,, Shur-Fen Liu,, Chun-Kun Wu,, Pel-Shen Wei,, Ching-Lian Weng,, Uei-Ming Jow,, Ying-Jiunn Lai,Year:
2002
Language:
english
DOI:
10.1109/EMAP.2002.1188863
File:
PDF, 459 KB
english, 2002