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Vapor compression refrigeration cycle for electronics cooling – Part I: Dynamic modeling and experimental validation
Catano, Juan, Zhang, Tiejun, Wen, John T., Jensen, Michael K., Peles, YoavVolume:
66
Language:
english
Journal:
International Journal of Heat and Mass Transfer
DOI:
10.1016/j.ijheatmasstransfer.2013.06.075
Date:
November, 2013
File:
PDF, 2.85 MB
english, 2013