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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Reliability of Cu Wire Bonding to Al Metallization
England, Luke, Jiang, TomYear:
2007
Language:
english
Journal:
Nanoscale
DOI:
10.1109/ECTC.2007.374009
File:
PDF, 5.90 MB
english, 2007