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[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - An assessment of lead free solder (Sn3.7Ag0.8Cu) wettability
Key Chung, C., Mustapha, F., Hua, F., Aspandiar, R.Year:
2002
Language:
english
DOI:
10.1109/EPTC.2002.1185587
File:
PDF, 652 KB
english, 2002