High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching
Brunet, Magali, Kleimann, PascalVolume:
28
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2012.2233219
Date:
September, 2013
File:
PDF, 772 KB
english, 2013