Thermal and electroless deposition of copper on...

IEEE Transactions on Advanced Packaging 2002 / 08 Vol. 25; Iss. 3

Thermal and electroless deposition of copper on poly(tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization

Yang, G.H., Kang, E.T., Neoh, K.G.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2002.805316
Date:
August, 2002
File:
PDF, 615 KB
english, 2002
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