A New High-Speed Memory Interconnect Architecture Using...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 02 Vol. 4; Iss. 2

A New High-Speed Memory Interconnect Architecture Using Microwave Interconnects and Multicarrier Signaling

Bensalem, Brahim, Aberle, James T.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2013.2283234
Date:
February, 2014
File:
PDF, 2.01 MB
english, 2014
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