Thermal Resistance Measurement of LED Package with...

Thermal Resistance Measurement of LED Package with Multichips

Lan Kim,, Moo Whan Shin
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2007.906332
Date:
December, 2007
File:
PDF, 615 KB
english, 2007
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