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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Study on the Low-looped Ability of Forward and Reverse Looping Methods of Gold Wire Ball Bonding for Stacked Die Package Application
Cheng, Xiu-Lan, Huang, Yu-CaiYear:
2006
Language:
english
DOI:
10.1109/ICEPT.2006.359871
File:
PDF, 5.88 MB
english, 2006