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Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
El-Daly, A.A., El-Taher, A.M., Dalloul, T.R.Volume:
587
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2013.10.148
Date:
February, 2014
File:
PDF, 4.13 MB
english, 2014