Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration
Park, M.S., Gibbons, S.L., Arróyave, R.Volume:
61
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2013.08.016
Date:
November, 2013
File:
PDF, 1.86 MB
english, 2013