Effective suppression of electromigration-induced Cu...

Journal of Alloys and Compounds 2013 / 7 Vol. 564

Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints

Wang, Chao-hong, Shen, Han-ting, Lai, Wei-han
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Volume:
564
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2013.02.053
Date:
July, 2013
File:
PDF, 1.45 MB
english, 2013
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