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The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints
Šebo, P., Švec Sr., P., Janičkovič, D., Illeková, E., Zemánková, M., Plevachuk, Yu., Sidorov, V., Švec, P.Volume:
571
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2013.02.013
Date:
June, 2013
File:
PDF, 1.85 MB
english, 2013