The Highly Selective Wet Etching Process of SiO[sub 2] to...

The Highly Selective Wet Etching Process of SiO[sub 2] to TiSi[sub x]

Won Hwang, Dong, Kim, Kook Ju, Lee, Yang Ku, Chae, Seung Ki
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Volume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3353202
File:
PDF, 381 KB
english, 2010
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