Evolution of thermal property and creep resistance of Ni...

Materials & Design 2013 / 10 Vol. 51

Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

El-Daly, A.A., El-Taher, A.M.
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Volume:
51
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2013.04.081
Date:
October, 2013
File:
PDF, 3.69 MB
english, 2013
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