Microstructure evolution, hardening and thermal behavior of...

Materials Science and Engineering: A 2014 / 03 Vol. 598

Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsion deformation

Wang, Chengpeng, Li, Fuguo, Li, Jinghui, Dong, Junzhe, Xue, Fengmei
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Volume:
598
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2013.12.079
Date:
March, 2014
File:
PDF, 4.27 MB
english, 2014
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