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Use of microcutting for high throughput electrode patterning on a flexible substrate
Janka, M, Tuukkanen, S, Tuorila, H, Viheriälä, J, Honkanen, M, Stingelin, N, Lupo, DVolume:
24
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/24/1/015015
Date:
January, 2014
File:
PDF, 827 KB
english, 2014