Reconstruction and thermal performance analysis of...

Applied Thermal Engineering 2014 / 04 Vol. 65; Iss. 1-2

Reconstruction and thermal performance analysis of die-bonding filling states for high-power light-emitting diode devices

Li, Zongtao, Tang, Yong, Ding, Xinrui, Li, Cheng, Yuan, Dong, Lu, Yifan
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Volume:
65
Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2014.01.004
Date:
April, 2014
File:
PDF, 735 KB
english, 2014
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