Evolution of microstructure, thermal and creep properties...

Materials & Design 2013 / 12 Vol. 52

Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

Hammad, A.E.
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Volume:
52
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2013.05.102
Date:
December, 2013
File:
PDF, 4.46 MB
english, 2013
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