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On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters
Di Maio, D., Hunt, C.P.Volume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910989402
Date:
September, 2009
File:
PDF, 404 KB
english, 2009