![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Absorption of Ag3Sn on Cu6Sn5 intermetallic compounds at Sn-3.5Ag-xCu/Cu interfaces
Zhao, Ning, Wang, Lai, Wan, Lixi, Cao, LiqiangYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270554
File:
PDF, 1.72 MB
english, 2009