![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of cooling rate and solder volume on the formation of large Ag3Sn plates in Sn-Ag based solder joints
Zhou, Qiang, Huang, Mingliang, Zhao, Ning, Zhang, ZhijieYear:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474868
File:
PDF, 735 KB
english, 2012