![](/img/cover-not-exists.png)
A novel simulation methodology for full chip-package thermo-mechanical reliability investigations
Karunamurthy, Balamurugan, Ostermann, Thomas, Bhattacharya, Monojit, Maity, SandipanVolume:
45
Language:
english
Journal:
Microelectronics Journal
DOI:
10.1016/j.mejo.2013.12.009
Date:
July, 2014
File:
PDF, 2.37 MB
english, 2014