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Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads
Tian, Yanhong, Zhang, Rui, Hang, Chunjin, Niu, Lina, Wang, ChunqingVolume:
88
Language:
english
Journal:
Materials Characterization
DOI:
10.1016/j.matchar.2013.12.006
Date:
February, 2014
File:
PDF, 4.29 MB
english, 2014