![](/img/cover-not-exists.png)
Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints
Zhang, Rui, Tian, Yanhong, Hang, Chunjin, Liu, Baolei, Wang, ChunqingVolume:
110
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2013.07.116
Date:
November, 2013
File:
PDF, 2.33 MB
english, 2013