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Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate
Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, LaiVolume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-013-1590-7
Date:
January, 2014
File:
PDF, 1.83 MB
english, 2014