Effects of zinc on the interfacial reactions of tin–indium solder joints with copper
Lin, Shih-Kang, Chang, Ru-Bo, Chen, Sinn-Wen, Tsai, Ming-Yueh, Hsu, Chia-MingVolume:
49
Language:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-014-8092-8
Date:
May, 2014
File:
PDF, 1.96 MB
english, 2014