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Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
Zhan, Zhan, Yu, Lingke, Wei, Jin, Zheng, Cheng, Sun, Daoheng, Wang, LingyunVolume:
21
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-014-2107-x
Date:
February, 2015
File:
PDF, 509 KB
english, 2015