Insulation reliability of fine-pitch through-vias in glass...

Journal of Materials Science: Materials in Electronics 2014 / 04 Vol. 25; Iss. 4

Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

Ramachandran, Koushik, Ready, W. Jud, Raj, P. Markondeya, Sundaram, Venky, Tummala, Rao
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Volume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-1784-7
Date:
April, 2014
File:
PDF, 7.12 MB
english, 2014
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