Dynamic Mechanical Properties and Thermal Effect of an...

Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component

Rmili, W., Deffarges, M.P., Chalon, F., Ma, Z., Leroy, R.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2876-5
Date:
March, 2014
File:
PDF, 542 KB
english, 2014
Conversion to is in progress
Conversion to is failed