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Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component
Rmili, W., Deffarges, M.P., Chalon, F., Ma, Z., Leroy, R.Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2876-5
Date:
March, 2014
File:
PDF, 542 KB
english, 2014