3D FEM Simulations of Drop Test Reliability on 3D-WLP:...

Journal of Electronic Materials 2014 / 03 Vol. 43; Iss. 3

3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Mohan, Ranganathan, Dosseul, Franck
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2964-6
Date:
March, 2014
File:
PDF, 1.00 MB
english, 2014
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