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Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds
Bhat, Kiran N., Prabhu, K. N., Satyanarayan,Volume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-013-1658-4
Date:
February, 2014
File:
PDF, 1.14 MB
english, 2014