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Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys
Weyrich, Nico, Jin, Shan, Duarte, Liliana I., Leinenbach, ChristianVolume:
23
Language:
english
Journal:
Journal of Materials Engineering and Performance
DOI:
10.1007/s11665-014-0864-4
Date:
May, 2014
File:
PDF, 753 KB
english, 2014