Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under...

Journal of Electronic Materials 2014 / 01 Vol. 43; Iss. 1

Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing

Yang, Tsung-Han, Lin, Yu-Min, Ouyang, Fan-Yi
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2790-x
Date:
January, 2014
File:
PDF, 530 KB
english, 2014
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