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Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications
Zhou, Bite, Muralidharan, Govindarajan, Kurumadalli, Kanth, Parish, Chad M., Leslie, Scott, Bieler, Thomas R.Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2788-4
Date:
January, 2014
File:
PDF, 1.49 MB
english, 2014