Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn...

Journal of Electronic Materials 2014 / 01 Vol. 43; Iss. 1

Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates

Yen, Yee-Wen, Hsieh, Yu-Ping, Jao, Chien-Chung, Chiu, Chao-Wei, Li, Yi-Shan
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2727-4
Date:
January, 2014
File:
PDF, 903 KB
english, 2014
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