Influence of High-GMechanical Shock and Thermal Cycling on...

Journal of Electronic Materials 2014 / 01 Vol. 43; Iss. 1

Influence of High-GMechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects

Lee, Tae-Kyu, Kim, Choong-Un, Bieler, Thomas R.
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2736-3
Date:
January, 2014
File:
PDF, 1.81 MB
english, 2014
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