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Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness
Tran, Hai T., Shirangi, M. Hossein, Pang, Xiaolu, Volinsky, Alex A.Volume:
185
Language:
english
Journal:
International Journal of Fracture
DOI:
10.1007/s10704-013-9907-3
Date:
January, 2014
File:
PDF, 1.10 MB
english, 2014